The Ideal Application Of Potting Compound For Electronics
There is a growing need to safeguard electronic assemblies from numerous factors, such as shock, vibration, moisture, thermal dissipation, and corrosive agents. Protection is often achieved through the use of a potting compound for electronics. Potting, in itself, comprises the process of filling an electronic assembly with a compound that offers permanent added protection.
You will often come across numerous potting compounds you can choose from, each with varied levels of viscosities needed for cure conditions and other features. Silicone, epoxy, and urethane are the commonly used compounds. In our post today, we will discuss everything one should know about these potting compounds.
About Potting in Electronics
Epoxy potting compounds are massively used for safeguarding the electronic elements and assemblies from the extremities in environmental conditions. Such compounds offer the best level of protection against the massive range of hazards that includes mechanical shock, corrosion, and temperature extremities. Additionally, using the epoxy potting compounds would help in minimizing the noise and vibrations caused due to the operating electrical and mechanical elements.
Considerations With Potting Of An Electronic Assembly
Resin Temperature
It is essential to heat the resin right before the potting process initiation. This enables the potting mixture to flow better through the system when production commences. Due to the massive range of resins available, it is important to contact the resin supplier so that they can recommend the best flow temperature.
Resin & Hardener Ratio
For a few, the hardener and the resin systems have varied weight ratios, generating the cured material with notable differences within the properties mainly for the hardness or flexibility. It is also recommended to consult with the supplier on potting compounds for electronics to determine whether the mixing ratio is fixed or variable. To attain the best outcomes for the applications, you have to perform a couple of trials before the start of the production volumes.
Mix of Material
After the ratios are controlled, the hardener and resin need to be blended. The function is generally attained using the detachable mixing nozzles. The nozzles must be detachable after the mixing process takes place, as they have a short lifespan. The entire curing process requires regular replacements.
Force of Mix
These materials need to be mixed at distinctive pressures. Little pressure results in an uneven mix. If you are still determining the accurate pressure you need or face issues with recent settings, it is recommended that you contact the suppliers for this material.
Dispense Volume/Weight
The much-required weight or volume for the mixed material is often achieved across several shots or a single controlled shot. It often relies on the size of the entire electronic assembly getting potted. The method of cylinder piston is often adjusted for regulating the dispensed amount; however limited through the cylinder size. As an outcome, in numerous instances, several shots are needed. The machine, along with the gear pump, will enable a single continuous shot that is controlled and set electronically.
Conclusion
Opting for the right Potting Compound For Electronics would notably extend their lifespan enabling it to get used across various spaces or applications that would safeguard the intellectual property of the company out of the casual finding.